• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method and apparatus for automatically changing a plating thickness in an electrical plating line in which unwanted over-plating is prevented. The plating line includes a plurality of plating tanks through which a member to be plated is conveyed and corresponding plating current sources. As a plating thickness change point on the member to be plated passes through the various tanks, a first plating current corresponding to a first plating thickness is applied through plating current power sources before the plating thickness change point, while a second plating current corresponding to a second plating thickness is applied through plating current power sources of tanks after the plating thickness change point. To prevent arcing as the plating thickness change point passes through the apparatus, plating current application is suspended in the two tanks on either side of the plating thickness change point.
    公开号:SU1419523A3
    申请号:SU833560001
    申请日:1983-02-15
    公开日:1988-08-23
    发明作者:Синкай Дайсук；Комото Харуо；Хамада Сигехару
    申请人:Мицубиси Денки Кабусики Кайся (Фирма)；Ниппон Стил Корпорейшн (Фирма)；
    IPC主号:
    专利说明:

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    The invention relates to devices for automatically changing the thickness of the electroplated coating in the electroplating line, more specifically to a device for automatically changing the current of electroplating.
    The purpose of the invention is to increase the quality

    coating and the prevention of spark-galvanizing. First and second low.
    Fig. 1 is a block diagram of a conventional electroplating current switching device; FIG. 2 is a block diagram of the mechanical design of the galvanic bath section; FIG. FIG. 3 is a block diagram of an automatic device for switching electroplating current.
    The device (Fig. 1) includes a pilot current drive circuit 1 which provides a total predetermined amount of electroplating current for coating thickness determined by the total power of available power sources and a line speed, speed proportional circuit 2 to multiply the total drive current value the proportional constant, which varies the proportional galvanizing circuits, work alternately in conjunction with the work of electroplating current switching circuit 9. The second circuit 10 is proportional to
    5 speeds are similar to circuit 2. However, circuit 10 works only when the point of change in the thickness of the electroplated coating passes through the section of the electroplating bath. A 2Q bypass switch 11 is closed to shunt the second speed proportional circuit, except when the line speed increases after passing the point of change in coating thickness through the bath section. The delay circuit 12 of the output proportional integrator for the time delay of the output of the value of the circuit proportional to the speed of the line, proportional to jg of the integrator 3 is valid only then.
    Integrator 3, whose output varies so that the output value of the current feedback circuit (described below) is equalized with the output of the speed proportional circuit, current distribution circuit 4, distributing the output of proportional integrator 3 between different galvanic baths, current switching circuit 5 electroplating for selectively connecting and disconnecting the current distribution circuits to their respective power sources, power sources 6 for supplying currents to the electroplating baths in accordance with the output values E circuit 4 current distribution, a chain 7, a total feedback current to determine the total amount of electroplating currents and supplying the detected value by the proportional integrator circuit 3.
    The mechanical design of the electroplating bath section is shown in FIG. When a band shaped element is passed through 35
    40
    45
    50
    when the point of change in the thickness of the galvanic coating passes through the galvanic bath section. The shunt switch 13 is closed to bypass the output delay circuit 12 of the proportional integrator.
    The second current distribution circuits 14 are similar to the first current distribution circuits 4 to determine the current distributions over 15 after changing the thickness of the coating. Position 16 designates switching circuits for switching distribution circuits 4 and 14 with each change in the thickness of the electroplated coating. Switching current switching circuit 9 operates when the change point of the galvanic coating thickness passes through the electroplating bath section and switches the outputs of the galvanizing current drive circuits 1 and 8 and the outputs of the proportional integrator output delay and the second speed proportional circuit 10.
    The device works as follows cut section of the electroplating bath, just 55 times,
    1dot plating is generally proportional to the sum of the currents of the power sources 6. Therefore, if
    the line speed is constant, the thickness of the electroplated coating is proportional to the set value of the electroplating currents, which is fused by the current reference circuit 1.
    The second driver circuit 8 current galvanization (Fig. 3) is connected in parallel with the first driver circuit 1 current
    The electroplating circuits operate alternately in conjunction with the operation of the electroplating current reference switching circuit 9. The second speed proportionality circuit 10 is similar to circuit 2. However, circuit 10 only works when the change point of the electroplating coating thickness passes through the electroplating bath section. The closing bypass switch 11 is closed to shunt the second proportional speed chain, except when the line speed increases after passing the point of change of the coating thickness through the bath section. Proportional integrator output delay circuit 12 for time delay of the output value of the proportional circuit in5
    0
    five
    0
    when the point of change of the thickness of the electroplated coating passes through the section of the galvanic bath. The shunt switch 13 is closed to bypass the output delay circuit 12 of the proportional integrator.
    The second current distribution circuits 14 are similar to the first current distribution circuits 4 to determine the current distributions over 15 after changing the thickness of the coating. Reference numeral 16 designates switching circuits for switching distribution circuits 4 and 14 with each change in the thickness of the electroplated coating. The galvanic current reference switching circuit 9 operates when the change point of the electroplating coating passes through the electroplating bath section and switches the outputs of the galvanizing current drive circuits 1 and 8 and the outputs of the proportional integrator output delay and the second velocity proportional circuit 10.
    The device operates as follows. Changing the galvanic coating thickness occurs at the point where the strip is cooking. In the case when the thickness is gal3U
    The coating can be changed at the points of welding, for the element being coated, the following conditions must be met.
    The element that has the shape of a strip must be re-covered in certain areas (i.e., it must be coated with an excessive thickness), because before and after the point of change in the thickness of the coating it has insufficient thickness and the element to be coated is not of adequate quality.
    In order to prevent the occurrence of sparks in the gaps between the strip and the conductive rollers 17, when the raised welding point passes through the waves 17, turn off the power supply 6 before and after passing the welding point.
    For conventional electroplating current control (without changing the plating coating thickness), the total current is set by the electroplating current setting circuit 1 and this value is fed through the speed proportional circuit 2 to the proportional integrator circuit 3, the output of the latter is fed through the shunt switch 13 to the current distribution circuit 4. Using the output gelicity of the circuits 4 as the reference current values, the power sources 6 generate the corresponding electroplating currents for the corresponding electroplating baths.
    The operation of electroplating current control before and after the point of change in the thickness of the electroplated coating is such that in the case when the line speed after the change is lower than the line speed to the point of change in the thickness of the electroplating under digging, when this point of change in the thickness of the electroplated coating reaches the input part of the electroplating bath section, the line speed is immediately changed to the value that is required after the change. At the same time, the control circuit for the next galvanic coating thickness is supplied to the second galvanizing current setting circuit 8, and from it through the second velocity proportionality circuit 10 to the second circuit 14 of the current distribution of the baths. In this operation, the shunt switch is open 13 and the output value of the proportional integrax circuit 3
    Ratio 3 is temporarily delayed by the output delay circuit 12 of the proportional integrator. The outputs of the first 4 and second 14 current distribution circuits of the baths are switched by the respective switching circuits 16 in accordance with the passage of the change point through the electroplating bath 15. At that
    At the same time, the power sources 6 before and after the point of change in the thickness of the electroplated coating are successively turned off to prevent the appearance of sparks on the conductive rollers 17.
    When the point changes thickness
    electroplating passes through electroplating bath 15, for those parts of the element that are located before the point of change, are applied
    0
    previous electroplating current values
    While the total electroplating current is applied to parts of the element located after the change point, the cotor is fed from the second electroplating driver circuit 8 through the second velocity proportionality circuit 10 and through the corresponding bath current distribution circuit 14. When the point of change of the galvanic coating thickness passes through the bath, the galvanizing current setting switch circuit 9 is triggered and the total current is controlled through the vanostegia galvanizing current circuit 8. Simultaneously with the operation of the switching circuit 9, the delay circuit of the output of the proportional integrator 12 is shunted by the operation of the shunt switch 13 and the output value of the circuit of the proportional integrator 3 is again used as the reference current value for the power supply sources 6.
    A change in the electroplating current, which is required to match the change in the thickness of the electroplated coating, is carried out for each plating bath, while the element to be coated is coated with a minimum excess amount of coating metal.
    In the conventional design of the device (Fig. 1), where the currents for all the baths vary simultaneously, a portion located 5 seconds between points A and B (Fig. 2) receives an excess amount of coating. On the other hand, in the device (fig. 3) only that part of the half-strip
    five
    0
    5U
    The scissor coating is located between points L and C (at the output of the first galvanic bath), which corresponds to a single galvanic bath, i.e. using the invention, the size (of the overlapped part of the strip is significantly reduced compared with the traditional approach.
    权利要求:
    Claims (3)
    [1]
    1. An apparatus for automatically changing electroplating current, comprising a first proportional circuit for outputting a first set current value proportional to a first electroplating line speed, first current distribution circuits over electroplating baths for distributing the output of the first proportional circuit to electroplating baths and setting electroplating current values, that, in order to improve the quality of the coating and prevent sparking, it is equipped with a second chain of proportionality, second chains of distribution ELENI current through the galvanic baths, and the switching circuit for the current values of each of the plating bath from the first current distribution circuit to the second distribution circuit at the time of entry points varying the plating thickness in the bath.
    236
    [2]
    2. The device according to claim 1, characterized in that the first proportionality circuit is equipped with a circuit for determining the total feedback current proportional to the integrator and a selective delay circuit of the output of the proportional integrator with its bypass switch.
    [3]
    3. The device according to claim 1, characterized in that it is provided with additional first distribution circuits for the baths of the output current value of the proportional integrator before passing through the point of change ff of the galvanic coating and additional second distribution circuits for the baths of the output current of the proportional integrator
    after passing the point of change
    galvanic coating thickness, switching circuits of current distribution in baths for selectively connecting the first and second circuits. distribution of currents in baths to the corresponding power source, switching circuit of galvanizing current command for selectively connecting the outputs of the first and second circuits of current assignment to the first and second outputs of the delay circuit the output of the proportional integrator, and the chain of proportionality to the first and second chains of current distribution among the baths.
    1
    类似技术:
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    JPS61119380A|1986-06-06|Arc welding method
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    同族专利:
    公开号 | 公开日
    JPS58140820A|1983-08-20|
    JPH0210962B2|1990-03-12|
    US4497695A|1985-02-05|
    DE3304621A1|1983-09-22|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US2427661A|1942-09-15|1947-09-23|Westinghouse Electric Corp|Control of electrolytic processes|
    US2463254A|1943-12-16|1949-03-01|Gen Electric|Electroplating control system|
    US3865701A|1973-03-06|1975-02-11|American Chem & Refining Co|Method for continuous high speed electroplating of strip, wire and the like|
    JPS53120640A|1977-03-30|1978-10-21|Sumitomo Metal Ind Ltd|Running control method for plating amount change in continuous electroplating line|
    US4240881A|1979-02-02|1980-12-23|Republic Steel Corporation|Electroplating current control|JPS60128298A|1983-12-16|1985-07-09|Nippon Steel Corp|Control device for automatic change-over of plating current|
    JPS60128295A|1983-12-16|1985-07-09|Nippon Steel Corp|Device for automatic compensation and control of plating current|
    US4749460A|1984-12-14|1988-06-07|Mitsubishi Denki Kabushiki Kaisha|Plating current automatic compensating apparatus|
    JPH0760657B2|1985-08-22|1995-06-28|株式会社日立製作所|Electron beam exposure system|
    AT384037B|1986-03-24|1987-09-25|Andritz Ag Maschf|METHOD AND DEVICE FOR CONTINUOUS ELECTROLYTIC TREATMENT AND / OR COATING OF A MOVING METAL TAPE BY CHANGING THE DISTANCE BETWEEN THE TAPE AND AT LEAST ONE ELECTRODE|
    DE3939681C2|1989-12-01|1993-01-28|Schering Ag Berlin Und Bergkamen, 1000 Berlin, De|
    US5181997A|1990-06-19|1993-01-26|Fuji Photo Film Co., Ltd.|Apparatus and method for continuously electrolyzing aluminum products|
    FR2704241B1|1993-04-22|1995-06-30|Lorraine Laminage|METHOD FOR REGULATING ELECTRO-DEPOSITION ON A METAL STRIP.|
    US6187153B1|1997-09-16|2001-02-13|Texas Instruments Incorporated|Comparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating process|
    EP0834604B1|1996-09-17|2002-07-10|Texas Instruments Incorporated|An electroplating process|
    US6090262A|1998-09-30|2000-07-18|Kabushiki Kaisya Aoyama Seisakusyo|Barrel plating method|
    US6217727B1|1999-08-30|2001-04-17|Micron Technology, Inc.|Electroplating apparatus and method|
    JP5506212B2|2009-03-05|2014-05-28|新日鉄住金エンジニアリング株式会社|Electroplating current control method|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    JP57023360A|JPH0210962B2|1982-02-16|1982-02-16|
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